Decapsulation and Die verification


 

Component Decapsulation 

 

 

Components Decapsulation is performed to inspect and authenticate the silicon die, the marking and logo of the original component manufacturer.  

 

Decapsulation is a process of using abrasive acids or mechanical drilling machine, in order to penetrate the component’s plastic package and expose the silicon die.

 

This process allows a direct visual inspect of the die, using a microscope. 

 

 


 

 

 

                      Component Decapsulation Example - GreenTree Electronics

 

 

 

 

 

 

 


 

 Die Verification - Testing Components at GreenTree Electronics

 


 

 

 

Die verification

 

Once the die is exposed, visual inspection and authentication can be performed.

Most manufacturers add their logo and marking code on the silicon die.

Die verification includes finding the logo and code, comparing the die size and structure between several samples of the same batch, comparing to a golden sample (if available).

Cracks, voids, corrosion or other abnormalities can also be find under microscope.

 

Decapsulation is a destructive test, meaning it requires some extra samples that are destroyed during the test.

 


 

Tests Performed by SMT Corporation:

 

X-Ray Imaging in real time

Energy Dispersive X-Ray spectroscopy

Scanning Electron Microscope (SEM) Imaging 

Acoustic Microscopy Imaging 

Component Decapsulation and Die verification

XRF RoHS testing

Fischerscope XRF/XDAL

Heated Solvent

Solderability Test

Electrical test