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X-Ray
X-Ray Imaging in real time
X-Ray Imaging Test is being done in order to identify different types of submicron defects on the component’s surface and internal elements.
Performing in Real-time machine, the components can be maintained in their original packaging and being examined without extracting them from the reel/tray.
X-ray inspection provides visibility to the internal silicon Die as well as the wire bonds and BGA balls.
This test is crucial to detect critical damages and counterfeits such as:
- Absence of Die or damaged Die
- Disconnected Die or damaged wire bonds
- Disconnected BGA balls or damaged balls.
- Non-uniform voids, gaps, structure of the die, wire and balls.
This test offers an analysis of different and complex structures for varying densities.
The X-Ray analysis is being done in real time, allowing a faster yet more precise analysis.
The inspector can enhance the image quality, and change the distance and diameter measurements of the examined component.
Energy Dispersive X-Ray spectroscopy
This tool, also known as EDS or EDX, offers elemental analysis or chemical characterization. Other X-Ray tools determine the material, while this tool performs a visual example.
By using this X-Ray tool, the inspector can produce a photograph of the actual composition of the component. This point is highly relevant to electronic components inspection, as it allows identifying counterfeit components. One of the most common method to counterfeit is blacktopping, which donates foreign materials on top of the component’s surface, and can be revealed during this test.
Tests Performed by SMT Corporation:
Energy Dispersive X-Ray spectroscopy
Scanning Electron Microscope (SEM) Imaging
Component Decapsulation and Die verification
